Cranfield Precision developed the World’s first silicon wafer edge grinding machine capable of operating in the ductile regime. The machine uses resin bond grinding wheel technology and is so revolutionary that eight patent groupings are covered by more than 30 patents worldwide.
In SSG, as shown in Fig. 3, a silicon wafer is held on a porous ceramic chuck by means of vacuum.The grinding wheel is a diamond cup wheel. The grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis , , .
NANSEN-SUB Machinery Manufacturing Co.,Ltd, established in 1976,is situated in JS Province,Nearly Shanghai City.area of 16,000 square meters, hs currently hired 120 employees, 20 engineers and technicians included, as professional in mechanical manufacturing and processing.
2017-12-13 Currently, the mechanical backside grinding based on wafer self-rotating is the most widely used method to remove the excessive silicon from wafer backside [3, 4] . During grinding process, the interaction between the abrasive grains and wafer surface leads to unavoidable damages , like cracks, stacking fault, dislocations of silicon
2018-3-4 Grinding wheels for manufacturing of silicon wafers: A literature review January 2007 International Journal of Machine Tools and Manufacture Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used
What is a Silicon Wafer? Silicon is a gray, brittle, tetravalent, chemical element. It makes up 27.8% of the earth’s crust and next to oxygen, it is the most abundant element in nature. Some of the most common materials that contain silicon are quartz, agate, flint, and common beach sand, among others.
PR Hoffman Machine Products is an industry leader in wafer lapping and polishing machines and consumables. Please take a minute and review the self-guided outline below that will help lead you to additional resources to enhance your wafer lapping and polishing requirements.
This machine is automatic precision grinding machine,the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel,the grinding wheel feeding by driving system. this method has low drag force,will not broke the wafer,and high productivity.
2016-8-26 Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We
The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.